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MEMS Packaging
Markets and Trends

A Strategic Report on Device-Level Packaging
of MEMS Semiconductor Products


Price $1995—Published January 2008, 150 pages


Download brochure with order form


Synopsis

Although it is a relatively new technology, the MEMS (micro-electromechanical systems) market for actuators, accelerometers, gyroscopes, pressure sensors, and microphones has become a substantial force in the semiconductor industry. Other MEMS products also show promise.

 

The manufacturing processes of integrated circuits (ICs) are the model used for the manufacture of MEMS devices. Not only are MEMS being created on wafers, but they are being combined in most cases with ICs within variations of standard IC packages. As such, MEMS package assembly has become a topic of great interest to the overall semiconductor packaging industry.

 

Electronic Trend Publications (ETP) in its report, MEMS Packaging Markets and Trends, uses information from semiconductor industry insiders to present the most realistic picture available regarding packaging technologies and markets for key MEMS products.

 

Chapter 1 of the report explains the scope and methodology of the report, while Chapter 2 summarizes the report’s key market data.

 

Chapter 3, Technical Trends, presents a concise technical overview of the MEMS market.  Topics include applications, device fabrication methods, and packaging options.

 

Chapter 4, Product and Company Highlights, presents the newest packaging products and latest research from over 70 companies and organizations. This presentation is organized into 17 categories of products and services.

 

Chapter 5, Forecasts, presents information on the sensor and actuator products that define the majority of the robust MEMS market. Products include accelerometers and gyroscopes, pressure sensors, microphones, and various actuators.

 

Forecasts of these MEMS markets include units, package assembly prices, average I/O counts, average assembly costs, and package assembly revenue. The MEMS packaging market is poised for substantial growth in the coming years.

 

MEMS Packaging Markets and Trends will provide you with an effective and economical tool for assessing the future of the MEMS packaging market. Please take a few moments to review the report's outline on the following pages. The report is delivered by email as a single-user PDF file. The report sells for $1995, with extra single-user licenses at $250 each. Corporate licensing is available—contact us for pricing.


Table of Contents

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: Technical Trends

Overview

Applications

Device Fabrication

Bulk Micromachining

Surface Micromachining

LIGA

Actuation Methods

Device-Level Testing

Packaging Options

Key Issues

Package Types

Encapsulation

Chapter 4: Product and Company
Highlights

Accelerometers

Actuators

Adaptive Optics

Chemical Sensors

Displays

Gyroscopes

Inertia Sensors

Insulin Pumps

Microphones

Micromirrors

Oscillators/Resonators

Pressure Sensors

RF MEMS

Viscosity Sensors

Foundries and Multi-MEMS Products

Packaging Contractors and
Prototype/Qualification Services

Substrates

Chapter 5: Forecasts

Microphones

Accelerometers and Gyroscopes

Pressure Sensors

Actuators

 

 

Partial List of Figures and Tables

Release of MOEMS Structure

Early Microresonator

Polysilicon Integrated Timing Reference

Poly-SiGe MEMS on Top of CMOS

Poly-SiGe Disk Resonators

Basic Principle of a MEMS Microphone

Bulk Micromachined Silicon Crystal

Surface Micromachining

CerPak

SEM Image of Metal Added to the Proof Mass

Multiple Sensing Gaps

GS3 Sensor Chip

GS3 Function

Microstrip Patch Antenna

Schematic of 3-D MEMS Chemical Sensor

Flip Chip Version of VI-MEMS Concept

Liquid Crystal Cell Process

Discera Packaged MEMS Resonator

Schematic Three-Dimensional View of RF MEMS Package

Schematic of the Package Process Flow

Schematic Design of 3-D Multilayer Module

Schematic Diagram of an LCP Surface-Mount Package

Bosch Pressure Sensor Housing Options

MEMS Microphone Market, 2007–2012

MEMS Microphone Packages, 2007–2012

MEMS Microphone Price per I/O for Package Assembly,
2007–2012

MEMS Microphone Average Package Price, 2007–2012

MEMS Microphone Packaging Revenue, 2007–2012

MEMS Accelerometer and Gyroscope Market, 2007–2012

MEMS Accelerometer and Gyroscope Packages, 2007–2012

MEMS Accelerometer and Gyroscope Package
Assembly Price per I/O, 2007–2012

MEMS Accelerometer and Gyroscope Average I/O Count by Package Type, 2007–2012

MEMS Accelerometer and Gyroscope Average Package
Assembly Price, 2007–2012

MEMS Accelerometer and Gyroscope Packaging Revenue, 2007–2012

MEMS Pressure Sensor Market, 2007–2012

MEMS Pressure Sensor Packages, 2007–2012

MEMS Pressure Sensor Average Package Assembly Price
per I/O, 2007–2012

MEMS Pressure Sensor Average I/O Count by Package Type, 2007–2012

MEMS Pressure Sensor Average Package Assembly Price, 2007–2012

MEMS Pressure Sensor Packaging Revenue, 2007–2012

MEMS Actuator Market, 2007–2012

MEMS Actuator Packages, 2007–2012

MEMS Actuator Average Package Assembly Price
per I/O, 2007–2012

MEMS Actuator Average I/O Count by Package Type, 2007–2012

MEMS Actuator Average Package Assembly Price, 2007–2012

MEMS Actuator Packaging Revenue, 2007–2012

 

 

The products, services, and research of the following companies and organizations are presented in Chapter 4 of the report:

 

Akustica

Amkor Technology

Analog Devices

ASE

Bennington Microtechnology Center

Bosch Automotive Electronics

Bosch Sensortec

Boston Micromachines

Carsem

Colibrys

DALSA Semiconductor

Debiotech

Discera

Ecliptek Corporation

Engent

Fraunhofer Institute

Freescale

GE Sensing

Gladiator Technologies

Hamamatsu Photonics

Hana Group

Honeywell

IBM

IMEC

Infineon

Innovative Micro Technology

InvenSense

Jazz Semiconductor

Knowles Acoustics

Kyocera

Matsushita Electric Works

Mems Technology

MEMSCAP

MEMX

Micralyne

microFAB Bremen

Midwest MicroDevices

Miradia

Momentive Performance Materials

NASA

NeoPhotonics

Norcada

NXP Semiconductors

Oki Electric Industry

Olympus

Omron Electrical Components

Philips Research

Plan Optik AG

QUALCOMM MEMS Technologies

Quantum Leap Packaging

Samsung

Sandia National Laboratories

Seiko Epson Corporation

Semefab (Scotland) Ltd.

SEMPAC

Sensorcon

Silex Microsystems

SiTime

Sonion MEMS

Spectra-Mat

STMicroelectronics

Teledyne

TeraVicta Technologies

Texas Instruments

The Bergquist Company

Tokimec

Tronics Microsystems

TSMC

University of California at Davis

VTI Technologies Oy

WiSpry

X-FAB

Yamaha

 


Price $1995—Published January 2008, 150 pages


Download brochure with order form

 


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